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Smart Electronics Professional custom rigid-flex board double-sided fpc multi-layer soft-hard board

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Smart Electronics Professional custom rigid-flex board double-sided fpc multi-layer soft-hard board

Professional custom rigid-flex board double-sided fpc multi-layer soft-hard board
Type：Rigid-Flex
Layer: Four layers
Substrate: Adhesive AR
Insulation material: organic resin
Insulation layer thickness: thin board
Flame retardant properties: V0 board
Processing Technology: Calendered Foil
Reinforcement Material: Glass Fiber Cloth Base
Insulating Resin: Polyimide Resin (PI)
Product Thickness: Soft 0.15mm; Hard 0.5mm; (Tolerance ±0.03mm)
Single piece size: customized according to customer's drawing
Thickness of copper foil: 18μm(0.5OZ)
shared：

Name：Sinking tin four layers of soft and hard bonding plate

Type：Rigid-Flex

Layer: Four layers

Substrate: Adhesive AR

Insulation material: organic resin

Insulation layer thickness: thin board

Flame retardant properties: V0 board

Processing Technology: Calendered Foil

Reinforcement Material: Glass Fiber Cloth Base

Insulating Resin: Polyimide Resin (PI)

Product Thickness: Soft 0.15mm; Hard 0.5mm; (Tolerance ±0.03mm)

Single piece size: customized according to customer's drawing

Thickness of copper foil: 18μm(0.5OZ)

Soldermask/Oil: Yellow film/Black film/White film/Green oil/Red oil

Plating and thickness:OSP(12UM-36UM)

Fire Rating:94-V0

Temperature Resistance Test: Thermal Shock 288℃ 10SEC

Dielectric constant:PI3.5;AD3.9.

Storage environment: Vacuum storage, lightproof, temperature <25℃, humidity <70%.

Processing customization: Yes


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